Last year, TSMC launched the N4 node as an extension of their N5 node; they are commonly referred to as "4nm" and "5nm," but they are in the same family. Later this year, the firm intends to begin producing chips based on the N3 next-generation node.
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According to reports, the N3 node will be utilised in certain forthcoming iPads. However, the next big update to Apple silicon will be based on the upgraded N3E node, which will boost performance and efficiency while also being more cost effective.
According to Nikkei Asia, the N3E node will be utilised for the Apple A17 and will go into full production in the second part of next year. The following Mac chip series, theN3E is also expected to be used by M3.
The latest Apple A16 chip, which is specific to the iPhone 14 Pro pair, is manufactured on the N4 node, the same as the Dimension 9000/9000+ and Snapdragon 8+ Gen 1. The A15 (N5) from last year is used in the vanilla iPhone 14 pair.
Analysts anticipate that the scenario will be similar next year, with the A17 processor reserved for the iPhone 15 Pro models and the non-Pro phones using a less sophisticated node (the A16 chip is the likely pick).
It should be noted that these nodes (N5, N4, and N3) continue to use FinFet designs, despite the fact that TSMC has created "FinFlex" for the N3 and N3E nodes. Customers will be able to modify the balance of chip speed vs. chip size as a result of this. size according to their needs. Gate-All-Around designs (based on nanosheets) will arrive with TSMC’s N2 node.
Samsung is already shipping chips built on its 3nm node and they utilize a Gate-All-Around design. Intel had initially made a deal to produce some 3nm chips at TSMC’s foundries this year or early next year, but three insiders claim that the order has been delayed to 2024.
