On August 18, Lenovo will unveil the Legion Y70 smartphone, and the firm has already released key details about the new flagship. It continued today with a variety of teases that provided additional information regarding the phone's cooling powers.
The business will release a whopping 5,047 sq.mm of 0.55 mm thick VC cooling. Yes, the chamber will have a half-millimeter-wide profile.
The base thickness of the Lenovo Legion Y70, which is 7.99 mm sans the protruding 50MP camera with OIS, will be exceptionally slim overall.
The phone is being advertised next to a refrigerator because it is evident that the device will bring 10 layers of heat dissipation materials and solutions.
As we can see, the new Legion smartphone seeks to preserve the sub-gaming brand's heritage while maintaining a more approachable appearance and feel.
For mobile gamers, there won't be shoulder triggers or a significantly altered user interface, but the Snapdragon 8+ Gen 1, 68W quick charging, and up to 16 GB RAM are still expected to deliver the best performance.
