Qualcomm announced last month that the Snapdragon 8 Plus Gen 1 processor, an upgraded version of the Snapdragon 8 Gen 1 processor, will power the majority of flagship smartphones released this year.
The company is also preparing to release the next-generation flagship processor, which is expected to be called Qualcomm Snapdragon 8 Gen 2, by the end of the year, and details about the chipset have begun to surface online.
According to a new report from Digital Chat Station, the upcoming Snapdragon 8 Gen 2 processor, which has the model number and codename SM8550 Kailua, will have a completely different cluster configuration.
The chipset will reportedly have a 1+2+2+3 configuration rather than the usual 1+3+4 configuration, and will be manufactured by Taiwan Semiconductor Manufacturing Company (TSMC) using its 4nm process.
The Snapdragon 8 Gen 1 has one big ARM core, three medium cores, and four low-power cores, which is a cluster design that most chip makers are now using for their high-end processors.
According to the report, the Snapdragon 8 Gen 2 will feature one Makalu generation core, two Makalu generation cores in another cluster, two Matterhorn cores, and three Klein R1 cores. The Matterhorn generation of ARM Cortex CPUs will be available in 2021, while Makalu will be available in 2022.
This means the Qualcomm Snapdragon 8 Gen 2 could include one Cortex-X3 core, which has yet to be announced, two Cortex-A720 cores, two Cortex-A710 cores, and three older Cortex-A510 cores, all of which will most likely be paired with the Adreno 740 GPU.
