In the third quarter, smartphones based on the MediaTek Dimensity 1050 will be released.
HIGHLIGHTS
1.The Dimensity 1050 from MediaTek supports both mmWave and sub-6 5G connectivity.
2. The Dimensity 930 supports full-HD+ monitors at up to 120Hz.
3. MediaTek's new 4G SoC is the Helio G99.
The Dimensity 1050 system-on-chip (SoC) was launched by MediaTek, a Taiwanese mobile chipmaker, on Monday as the company's newest model in the Dimensity range. The new chip is the first from the company to support millimetre-wave (mmWave) 5G connection in addition to the widely used sub-6GHz frequency. With the inclusion of mmWave 5G compatibility to the Dimensity 1050 SoC, MediaTek has increased the rivalry for Qualcomm, which already has Snapdragon platforms that support the same cellular network technology. Other CPUs for next-generation smartphones from MediaTek include the Dimensity 930 and Helio G99.
The MediaTek Dimensity 1050 SoC has an octa-core CPU built on TSMC's 6nm manufacturing technology. On sub-6GHz (FR1) frequency, the chip provides 3CC carrier aggregation, while on mmWave (FR2) spectrum, it offers 4CC carrier aggregation. The Dimensity 1050, according to the manufacturer, can give up to 53 percent quicker speeds and greater reach to smartphones via LTE + mmWave aggregation.
The Dimensity 1050's mmWave 5G compatibility will aid in providing greater connection in smaller, highly populated locations.
With the new Dimensity SoC, MediaTek has combined two ARM Cortex-A78 CPUs with speeds up to 2.5GHz, as well as the ARM Mali-G610 graphics processing unit. Wi-Fi optimisations and Wi-Fi 6E support are also included, as well as a 2x2 MIMO antenna and MediaTek's HyperEngine 5.0 gaming technology to allow lower-latency connections with the new triband 2.4GHz, 5GHz, and 6GHz frequency. UFS 3.1 storage and LPDDR5 memory are also supported by the chip.
Along with MediaTek's Miravision 760 video enhancement technology, the Dimensity 1050 SoC enables 144Hz full-HD+ monitors. Using a dual HDR video capture engine, the chip can transmit simultaneous streams through the device's front and rear cameras. There's also the MediaTek APU 550, which supports artificial intelligence (AI)-based camera actions. The business also claims that low-light images have improved noise reduction.
Aside from the Dimensity 1050 SoC, MediaTek also announced the Dimensity 930, a new 5G processor that supports mixed duplex FDD+TDD for fast connectivity. The processor also supports full-HD+ screens at 120Hz, as well as MiraVision HDR video playback and HDR10+ content. Additionally, there are gaming optimizations in HyperEngine 3.0 Lite that promise better latency and longer battery life.
The MediaTek Helio G99 was also announced as an upgrade of the Helio G96. The new 4G chip is said to save more than 30% power in gaming compared to the previous Helio model.
n the availability part, smartphones based on the Dimensity 1050 and Helio G99 will be available in the third quarter, while the Dimensity 930 will debut in the global markets in the second quarter, MediaTek said.
