The Dimensity 1050 is Mediatek's first chipset with mmWave 5G capability. It will offer seamless connectivity by switching between Sub-6GHz and mmWave standards with ease. It's made using a 6nm technology by TSMC, and the business has promised devices utilising it as early as Q3 2022.
The Filogic 880 and Filogic 380 with Wi-Fi 7 and Bluetooth 5.3 integration were also presented by the Taiwanese business.
The Dimensity 1050 features an octa-core CPU with two Cortex-A78 units running at 2.5 GHz and six Cortex-A55 units running at 2.0 GHz, as well as a Mali-G610 MC3 GPU. The mmWave has 4CC carrier aggregation, whereas the Sub-6 only has 3CC.
Finally, Mediatek introduced two new CPUs that will power tomorrow's lower mid-range phones. The Dimensity 930, for example, has quicker connectivity than the 920 and can support 120Hz Full HD+ displays with HDR10+. The Helio G99 is an upgrade of the LTE-only Helio G96, constructed on a 6nm technology rather than a 12nm platform.
