Oppo is expected to release its first SoC in 2024, followed by an application processor in 2023.

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HIGHLIGHTS

  • Oppo application processors are expected to enter mass production in 2023.
  • Initially, Oppo's SoC may not give as good performance as Qualcomm's SoC.
  • MariSilicon X NPU for photography has already been released by Oppo.
According to a report, Oppo plans to launch its first mobile platform in 2024. The Chinese corporation will follow in the footsteps of industry titans such as Apple, Samsung, and Google, who employ in-house designed SoCs in their devices. Google is the most recent addition to this list, having introduced the Google Tensor SoC in the Pixel 6 and Pixel 6 Pro smartphones. Oppo may potentially unveil an Application Processor (AP) in 2023, according to reports. The announcement comes just a few months after the company released the MariSilicon X NPU for photography.

According to a claim in the Chinese journal Laoyaoba, Oppo would debut the unique mobile chipset in 2024 utilising the 4nm production technique of Taiwan Semiconductor Manufacturing Company (TSMC). The SoC will include a built-in AP and modem. Aside from that, the corporation is stated to be focusing on constructing an Application Processor (AP), which will go into mass production in 2023. It is reported to have been made utilising TSMC's 6nm manufacturing technology.

According to industry observers, Oppo's Custom SoC may not be able to compete in terms of performance with Qualcomm and MediaTek. Analysts believe that the chipset might be tested in low-end cellphones before being utilised to power high-end smartphones. There is no word on what the name of this mobile platform will be. Apple provides A-series SoCs, Samsung Exynos chipsets, and Google Tensor.

Oppo has debuted its MariSilicon X Neural Processing Unit (NPU) during Oppo Inno Day in December. The NPU is intended to revolutionise photography, and Oppo boasts that it is both power efficient and capable of capturing 4K films at night. The Oppo MariSilicon X NPU is built on a 6nm advanced manufacturing node and has terabytes of dedicated memory capacity.

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