The Samsung-made Snapdragon 8 Gen 1 is struggling to stay up with its main competition, MediaTek, which has recently been outperforming it with its latest TSMC-made Dimensity chips. The Dimensity 9000's early benchmark results were found to be higher than the Snapdragon 8 Gen 1's, and as if that wasn't enough, the Qualcomm flagship has now now been surpassed by the Dimensity 8100.
Geekbench data for the Dimensity 8100, Snapdragon 8 Gen 1, and Snapdragon 888 were revealed today by tipster Digital Chat Station, with the MediaTek processor handily beating the other two on the multi-core test. All of the devices utilised were realme, with the RMX3562 being the new realme GT NEO3.
However, because to the inclusion of a super-powerful Cortex-X1 core on both Qualcomm chips, the D9000 came in last in the single-core test.
Regardless, it's impressive to see a chip that isn't even MediaTek's best this year defeat two Qualcomm flagship processors. The Dimensity 9000 processor is MediaTek's flagship solution for 2022, while the Dimensity 8000 series is only geared for upper-mid-range smartphones. Furthermore, the Dimensity 8000 processors use an older 5nm technology, as opposed to the Snapdragon 8 Gen 1's cutting-edge 4nm process.
Qualcomm, on the other hand, has another card in its deck. Another flagship CPU from Qualcomm has been circulating recently, and based on the SM8475 product number, it will most likely be an improved Snapdragon 8 Gen 1 Plus. This one will be made with TSMC's better 4nm technology, rather than Samsung's 4nm process that was used for the first-gen 8 Gen 1. It will be fascinating to see how the improved version compares to competitors.
