According to an expert, the camera bump on the rear of the new "iPhone 14 Pro" and "iPhone 14 Pro Max" schematic leaks will be larger to accommodate the larger image sensor, with the transition to a 48MP sensor requiring more room.
On March 22, supposedly leaked blueprints for Apple's autumn iPhone update suggested that, despite speculation in renderings, the camera bulge on the back will likely remain for another year. The choice to keep the hump rather than remove it may be due to the other suspected camera adjustments.
Apple is said to be switching from 12-megapixel to 48-megapixel camera sensors, which will be a significant increase for the smartphone. Because larger sensors will be employed, the design must account for the amount of space occupied inside the device.
TF Securities analyst Ming-Chi Kuo speculated on the schematic release on Sunday, indicating that the major reason for the increase in the iPhone 14 Pro range is due to "upgrading the wide camera to 48MP."
According to Kuo, the diagonal length of the high-resolution picture sensor would be between 25% and 35% longer than that of the 12-megapixel version. Not only will the diagonal width increase, but the 7-piece (7P) lens for the sensor will also increase by 5% to 10%.
It's a tough order to increase the size of imaging components while minimising the bump in an exceedingly constrained gadget. It's acceptable for Apple's engineers to contemplate leaving the well-known bump in place for a little longer, so that the cameras may be upgraded without negatively effecting the other internals.
