The MediaTek Dimensity 8100 chipset will be announced soon, and it will be a scaled-down version of the premium Dimensity 9000 chipset. The same chipset is believed to power the next "Rubens" (Redmi K50/ Redmi K50 Pro) handset, however there has been no official confirmation. The Dimensity 8100's specifications are now available online.
Dimensity 8100 chipset from MediaTek
The details of the new MediaTek Dimensity 8100 chipset have been published by known tipster Digital Chat Station on the Chinese microblogging platform Weibo. The chipset will be built on an octa-core CPU with 4X Cortex A78 performance cores clocked at 2.85GHz and 4X Cortex A55 power-saving cores clocked at 2.0GHz, according to him. The Mali G610 MC6 CPU will handle graphically intense and gaming-related tasks. The GPU's frequency is yet unknown. The L3 cache on the chipset will be 4MB. The chipset will be manufactured using TSMC's 5nm technology.
As previously said, Redmi will be one of the first smartphone manufacturers to use the following chipset. The Dimensity 9000 is equipped with a 1X Cortex X2 clocked at 3.2GHz, 3X Arm Cortex-A710 clocked at 2.85GHz, 4X Arm Cortex-A510 clocked at 1.8GHz, and a Mali G710 MP10 GPU. The Dimensity 9000 has slightly more powerful specifications than the Dimensity 8100. The Qualcomm Snapdragon 888 chipset is expected to compete with the MediaTek Dimensity.
Apart than that, there isn't much information available about the chipset. The chipset's specifications will be revealed when MediaTek makes an official announcement. The chipset's official introduction is expected in the following months.
